*OFFICIAL* Alienware 17 R5 Owner's Lounge

Indeed. That's why people should stop jumping on the AW bandwagon. The vapor they're talking about is the heatsink fluid that sits whitin the headsink.

Heat pipes work by having a fluid inside which evaporates into a gas when it gathers enough heat. The rising gas moves the heat far from the CPU and then condenses back into a liquid where it is funneled back to the bottom using capillarity.

Vapor chambers rely on pretty much the same concept, but they have a different approach to design. Rather than using separate pipes, a vapor chamber uses its entire body to cool the CPU. Its flat structure allows heat to be transferred evenly through a very small amount of space. This is advantageous in situations where you have a massive gas-guzzler of a CPU crammed into a tiny structure such as a laptop. Vapor chambers are much more efficient, dissipating up to 2000 Watts of heat in an area of around four square centimeter. https://www.1-act.com/high-heat-flu...nd-planes-for-direct-die-attach-applications/

 

AS far as I knwo they implemented it the same way as Nvidia did with the 1080GTX with the foudners edition cooler. The orientation is the same.

 

Hi11zone when do you get your laptop from HIDrevolution? It will be really interesting. If you have nice temps it will really be a heads up!

The rest of us who dont live in US will have to do it ourselves but at least its going to mean its the crap thermal grease and pads used by Dell.

 

HIDevolution do deliver to UK and Europe
As they have a distribution network warehouse in UK , I’m just waiting on confirmation if they deliver to Isle of Man as tried last night and didn’t accept iom address but do accept UK


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They do ship to UK, but I am not sure if they can get a UK keyboard from Dell for Alienware models. I think @Pete Light here in the forums offered repaste services in the UK for the 17 R4 / 15 R3. Sometimes Dell will offer a partial refund if you choose to keep a machine instead of returning. If they did, maybe that would pay for repasting..

 

How much does it cost to repaste? Does HIDevolution offer repaste services to already bought machines? I will probably do it myself as I did in the past and still doing for AW M17X R2. It is faster and cheaper.

By the way, still no reply from Dell as of today regarding refund.

 

Ya they do ship to uk and soon as I get it ill let you guys know! Still being built. My guess 2nd week of june. This was a birthday present that I got myself . Today im 32. However this is way out of my budget lol Even sold my water cooled pc. But I had to have it!

 

I was saving since AW M17X R2 times to buy an alienware radiator

 

Nice, HIDevolution have emailed me and said they do deliver and will sort one for myself soon as I decide on laser engraved artwork etc


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No they did not. The GTX 1080 founders edition has no copper inside. The AW has copper from the heatsink die to the fans, for transferring the heat. The heatsink is almost exactly the same from the 2016/2017 models. They've changed 3 things. That's it.

Vapor chamber cooling sits directly over the DIE of the CPU or GPU with a fan attached to the Vapor Chamber.

 

The right is the heatsink used by the latest Geforce cards that need it (it was the Titan and 1080TI that used it, thought the 1080gtx as well but thats not the case). A vapor chamber design. http://i.imgur.com/hzZ70RH.jpg

This is what I expect from the latest Alienwares if I go according to what they tell. Havent seen the underside yet of the new heatsinks.

 

Exaclty the picture you provided is what a vapor chamber heatsink looks like.

AW does not have that. That's, cause the heatpipes are bend the same way it is like how the 2016/2017 model are bend. Just like I stated in my other reply.

Again the heatsink 2016/2017 vs 2018 only thing they changed are thinner fanblades, and made the upper cpu heatsink arm stronger that's it.

If the vapor chamber would sit over the CPU die, it would mean they had to redesign the whole chassis. The motherboards are also the same from Kaby lake to Coffee-lake, except they upgraded the Chipset and a few other minimal changes (like adding two extra cores making the DIE slightly longer than a Kaby-Lake DIE.

AW has no vapor chamber cooling. Just a traditional heatsink design with a fan pulling air over the heatsink so the heat can transfer from the DIE to the cold side.

 

Several ways to design how the Vapor chambers shall work.

I think Alienware use more of a Hybrid Vapor Chamber solution who use the pipes to remove the heat to the grills (only to lift of heat from the cpu die). The Clevo's one piece Vapor chambers cooling solutions... The pipes will be used as guidelines to direct the heat to the heatsink grills on top of the working vapor chambers channels.

Hybrid (1-Piece) Vapor Chamber
Available from a growing number of manufacturers, one-piece vapor chambers are a cost reduced version of their two-piece counterparts, yet maintain the thermal performance characteristics while adding some unique capabilities (e.g. U-shape bending). Like heat pipes, a one-piece product begins its life as a single copper tube, hence the 1-piece moniker. Like traditional two-piece designs, one piece vapor chambers make direct contact with the heat source, have a multi-directional heat flow, and can support clamping forces of up to 90 PSI. But they’re less expensive to produce because they require less tooling.

I think Dell would be sued by a hell many angry buyers if Dell's information on their websites is fake. But any Vapor Chamber won't be more effective than how the engineers want it to be.

 

for the pipes to be used as a transfer effective vapor chamber cooling, the pipes go up. as the heat will transfer more easily and transfer better when the grills are positioned in the lenght at the top (with fans attached to the chamber). a vapor chamber cooling sideways won't work (effectively), cause it won't move enough heat for the flux to become gas. the xbox one x also uses a real vapor chamber (directly placed over the DIE) and it could never be cooled with heatpipes, the same problem AW is running in to right now.

the only way a hybrid vapor chamber cooling would work is by having the pipes placed in a angle, allowing the heat to transfer upwards. the biggest difference between a vapor chamber and heatsink cooling is not the design, but the way they handle heat. Dell still uses the same old method used from back in the day by MOVING heat FROM the die. a vapor chamber works by SPREADING the heat over the vapor chamber surface, so the heat can be transfered to the fins.

that hybrid stuff is marketing crap, a vapor chamber is only one part. and that's the chamber, the second part is the fan to pull or push air over the fins of the chamber. there are stamped vapor chammber made out of two parts, soldered against eachother. that's mostly for the DIE area.

within a 737 underneath the cockpit, all the computers are cooled with a vapor chamber cooling on a large scale. most modern planes use bleed air to cool the whole computer room.

 

I'm sure it works. But as I stated in my previous post... Several ways to design it and the cheaper you do it the worse the results will be. You can design/produce it cheap as Hell, and the cooling will suffer. But as always any Vapor Chamber won't be more effective than how the engineers want it to be.

Fyi. The Nvidia "Founders Edition" use Vapor chamber cooling, but second hand high quality heatpipe cooling from their AIB partners will work better.

We know the Vapor chamber cooling work well in the Clevo.

 

The clevo indeed has a vapor chamber cooling ! but that's because it sits directly on top of the DIE.

a vapor chamber with heatpipes lookes like this and won't fit in laptops for a few years:



3D vertical vapor chambers are stilll being developed in labatories for purposes like cooling within a laptop.

AW just uses heatpipes to transfer the heat to the grills where the fans sits. of AW would use a vaporchamber design, the laptop would've become thicker.

https://item.taobao.com/item.htm?sp...Hczf92&id=543397569914&ns=1&abbucket=5#detail

how much i want to, AW is not able to produce it right now.

 

Just replace the major copper cold plate for Cpu die. Instead use a cheap vapor chamber heatspreader on top and attach it with the copper base and pipes. All roads lead to Rome, bruh Not all need to cost a fortune. And Vapor chambers can be as thin as 2-4mm. How it works aka provide top notch cooling is another matter. Explained already in previous posts.


Read also how old days cooling worked.... https://en.wikipedia.org/wiki/Thermoelectric_cooling

 

yes that picture is of the sandwiched 2-phase cooling !!!! those are used in some airplanes ! and because the tolerances are so low with those (if AW would put it on the DIE) m afraid that it would not even work as designed... but you're right have to hand it down to ya ! more ways lead to rome indeed and there could be new VC methods implemented, if not AW other companies could cook up something. just like you said more ways lead to Rome.

the vappor chamber design i've come accustomed to is the one Boeing uses in their older planes, but the 737 is one of the modern planes in the bunch that still uses VC. but those are for industrial purposes and is moslty positioned like this:

this one was for example primarily used for the Radars. but that's a whole other level compared to consumer products.

something like the the heatspreader could be well used within the AW for example, but it would bulk up the chassis. even if it's just for another 3/4mm but i don't think the executives would agree with that.

for now, cryo-tech v2.0 (where we did not even see a 0.1 or a 1.0) is just marketing (for me). in coding it would imply the second revisison, for AW it'st just to attract casual gamers.

 

A copper heat pipe, hollow and sealed with water, or a solid copper rod?

 

A copper heat pipe hollow sealed with gas. Not water.

Heat travels trough the heatpipes, making the gas change it's phase from gas to liquid.

At the one end you have the grills where the heatsink flux is still gas, at the other end, where the heatsink DIE area is located, the heatsink flux has become liquid due the DIE area of the heatsink being exposed to heat. The fan pulls air over the heatsink grills cooling one side. While the other side stays cool.

The liquid goes down throughout the heatpipes, and goes back to the grills where it becomes gas, and circles back to the Die area.

There are different heatsink design, but the principle is the same. You should Google the Samsung Galaxy S7 edge. It also uses the same heatsink, with gas embedded within the heatsink.

http://pocketnow.com/2016/04/14/galaxy-s7-cooling-system-explained

 

Any ideas for liquid nitrogen cooling on laptops? This would solve all the issues once for ever.

Anyways, I received a positive reply regarding refund today. I will test the liquid metal and new thermal pads first.. It is not only the value of the laptop I am thinking about but also the extra ram and samsung Nvme/ SSD drives I bought. And the oculus rift bought to try (which is still in the box being scared to try due to high temps).

By the way, Any suggestions for similar laptops with similar specs and proved better cooling? NVME slots and 2667MHz ram slots to be available please. Prices not more than 2600 pounds please. Links would be appreciated.

 

I'd suggest contacting @Donald@HIDevolution, he is an amazing rep that will help you really narrow down what you need, or simply try to configure a laptop on their website with similar specs.

 

The cost would probably be prohibitive for using HIDEvolution if they did, you are paying a couple hundred in shipping

The only options right now are MSI GT75VR, Auros X9, Asus G703GI, Clevo P870TM1, Clevo P775TM1. If 2600 is your budget then the P775TM1 / P870TM1 should be the least expensive choices.

 

Do we have any temp logs for Asus G703GI? I see there is an 8950HK version (G703GI-XS98K)?

 

Razers engineers needed to develope new cooling (fully Vapor chamber) for their 2018 models, otherwise would the 6 core Coffee chips boil near 100C all day in the thin chassis.

As I have pointed ot several times, there is different ways to design and use Vapor chamber cooling in notebooks. From cheap Vapor chamber heatspreader combined with heat pipes or just create one piece VC cooler as showed below. The Hybrid VP champer solution + pipes cost less. The more money you put into the cooling the better it should work.

 

By the way, this reminds me of my <<old>> M17X R2 heatsinks:

GPU: https://www.google.co.uk/search?q=A...UICygC&biw=2560&bih=1309#imgrc=PgPPOqDCFEFEuM:

CPU: https://www.google.co.uk/search?rlz.....0.0.0....0.pgDhOWm7UD8#imgrc=wpzLTz07M2UGjM:

Ages of solid!

 

Yes that's what I verified when you provided the picture. Razor Clevo and Asus also uses a vapor chamber cooling, but AW doesn't. That's what I tried to explain.

The main difference between a heatsink, and a vapor chamber again is that a heatsink draws heat away while a vapor chamber divides the heat over the vapor chamber, so the gas can evaporate, and become liquid to flow.

Heatsinks also poses over that type of cooling, but it draws the heat away from a die to the heatsink fins where the fans blow or suck the air to create the phase change of the gas within the heatsink. It's something phones are also using nowadays.

 

Mobile tech review has the 17r5 as a lengthy review

Funnily enough it throttled!

 

Alienware 17R5 reviewed by Mobile tech. Awful results. And with stock clocks.
http://forum.notebookreview.com/thr...950h-coffee-lake.810891/page-72#post-10733001

 

That's the one... Throttled worse then we all have seen. She said that the cooling system didn't look much different.
It's nice to finally see someone reviewing it on YouTube after so long!
Let's see once it's passed around... Hopefully they do something about it! (pigs may fly)

 

You are making it sound unnecessarily complex, like some sort of retired nuclear scientist

"Gas" is a state of matter, the other two states are "liquid" and "solid". Heatpipes used in homes have liquid inside at room temperature. The very known liquid that stays liquid between 0C and 100C is .... water...

Here look at this:

(scroll to 1:19)
​

And these:


(scroll to 1:15 more or less and watch)




(scroll to 2:18 )


So when I said is it a solid copper tube or hollow and filled with water, water means liquid else we'd call it "ice" or "steam"

And it also works against gravity due to capillary action in the walls of the heat pipes which have grooves, pit holes or whatever, as shown in the above videos.

 

By the way I wonder have they filled it with anti-freeze water? The other video said "distilled water". What happens if you live like in Russia where temps drop to -40C and stay like that for weeks? Or is the water quantity so small that even if it expands it will not burst the pipes and the chambers?

 

just like i stated in my other reply's. it's a gas that evaporates and becomes a liquid. that's called deposition. look it up. in the early 60's when nasa started working with heatsinks, they needed them for the gemini mission.

As a workaround to this complexity, Burke turned to a kind of passive, closed-loop technology that would simplify the cooling process. What he had in mind were heat pipes: hermetically-sealed metal plates that use an internal phase-changing fluid to transfer heat. Basically, the heat pipe draws in heat from an adjacent source, which causes the liquid inside to evaporate. The vapor travels to a lower-pressure area of the device where the energy is transferred to a heat sink. Having lost energy, the vapor CONDENSES back into liquid and is wicked by a porous metal structure back to the evaporator section, where the process starts over again.

https://spinoff.nasa.gov/Spinoff2015/ip_8.html

look at the word condenses.

https://en.wikipedia.org/wiki/Condensation

Condensation: the conversion of water from a gas into a liquid. Condensation is the change of water from its gaseous form (water vapor) into liquid water. Condensation generally occurs in the atmosphere when warm air rises, cools and looses its capacity to hold water vapor.

nowadays the technology has changed a bit, but the workings not. they now use something called "eutectic fluid" so the two or more components within the heatsink.

when you apply for a job at KLM you have to know the ins and outs of a airplane. and instead of providing video's of people that make some youtube video at home, you should provide scientific recources. a video with comments disabled is already ******** to me, cause why should the comments be disabled ? if you're talking the thruth.

https://celsiainc.com/blog-heat-pipes-and-vapor-chambers-whats-the-difference/

"The thing to remember about two phase devices is that heat pipes favor moving heat over spreading it, while the reverse is true of vapor chambers. For sure, there are numerous thermal challenges where either could be used with good results so it’s important to do a thorough review process of both designs for settling on one."

again it's not water. water is only one element. eutectic fluids consist of a mixture of different fluids, that can become gas and fluid at the same time.

https://en.wikipedia.org/wiki/Eutectic_system

A peritectoid transformation is a type of isothermal reversible reaction that has two solid phases reacting with each other upon cooling of a binary, ternary, ..., {\displaystyle n\!} ary alloy to create a completely different and single solid phase. [15] The reaction plays a key role in the order and decomposition of quasicrystallinephases in several alloy types.

it sounds simple, but it isn't. heatsink and vapor chamber cooling is a whole different ballgame then for example cooling with a intercooler. even though they do the same job at the same way, how it's implemented is very different.

 

Since it seems like the Dell Alienware will not be fixing their thermal issues anytime soon, and am now looking for alternatives. Unfortunately there is no MSI custom built dealer in the UK, pretty much you go to buy off the shelf and I want a custom build. PC Specialist in the UK sell the Clevo P775TM1-G disguised as "Octane V" but it comes with a "lesser" 4K panel, the AUO B173ZAN01.1 whereas the Dell AW 17 R5 comes with the AUO B173ZAN01.0 - according to panel look the 1.0 version used on the Dell is G-sync and more importantly brighter at 400 nits, whereas the 1.1 is at 300 nits and no G-sync. However there is another Clevo supplier in the UK, scan, and they sell the P775TM1-G and need to contact them to see what panels they use (they say G-sync so it must be the 1.0 which is what I want).

 

You mean the other way round. Gas is a gas, it's already "evaportated"

 

Condensation is the change of the physical state of matter from gas phase into liquid phase, and is the reverse of vapourisation.

https://en.wikipedia.org/wiki/Condensation

Deposition is a thermodynamic process, a phase transition in which gas transforms into solid without passing through the liquid phase. The reverse of deposition is sublimation and hence sometimes deposition is called desublimation.

https://en.wikipedia.org/wiki/Deposition_(phase_transition)

heatsinks do not work with water or vapor. they work with deposition.

And gas is not evaporated. gas is the phase AFTER EVAPORATION where water evaporates, and becomes gas. Evaporation is the action of a LIQUID BECOMING GAS OR CHANING TO A GAS LIKE STATE. if they would use water within a heatsink, it would start to corode from the inside out. also the evaporation point of water is 100C (212 F). if a heatsink would be under that 100C water would still be liquid, and would not flow within the heatsink. that means that the heatsink would cook at one side of the heatsink and at the other be cold as f*ck, without the heat transferring. that's why they use eutectic fluids.

 

You said many times "it's a gas that evaporates and becomes a liquid". Your words and you are wrong.

Another wrong statement : " if they would use water within a heatsink, it would start to corode from the inside out." Maybe you would like to tell that to the manufacturer "ATS Thermal Solutions Inc" who clearly state they use ... (distilled) water in their heat pipes. It's in the video I posted.

 

brother read again i talk about a heatsink. you're talking about PIPES !

Heatsinks
A heatsink is a metal object attached to the top of the CPU. It works by drawing heat away from the CPU itself and dissipating it into the air. Two factors determine how well a heatsink functions:

• Thermal conductivity
• Surface area

Thermal conductivity measures how easily heat can move through the material. For example, a metal spoon has a much higher thermal conductivity than a wood one. Thus, when a metal spoon is left in a hot pan, the heat travels from the end in the soup to the handle end, making it hot. However, a wood spoon sitting in the same pot of soup will not transmit the heat to the handle anywhere near as effectively.

Each type of material has its own specific thermal conductivity. Among metals, the highest thermal conductivity is found in silver, followed by copper, gold, and then aluminum. Since gold and silver are too expensive for making heatsinks, they are usually made of aluminum or copper.

Copper heatsinks are considerably better than aluminum ones because copper has a 70-percent higher thermal conductivity. However, copper is considerably more difficult to fabricate parts out of than aluminum. It is also much more expensive than aluminum, so more heatsinks are made out of aluminum than copper. Some aluminum heatsinks take advantage of copper’s higher thermal conductivity using a small copper pad that provides contact with the CPU.

To make heatsinks effective, they need a lot of surface area to be in contact with the air. This is why most heatsinks are designed with "fins" to create more surface area for transferring heat to the air around the heatsink.

A heatsink alone cannot provide enough cooling for modern CPUs. They need to be used in conjunction with a fan to increase the airflow over the heatsink’s surface area.

Heat Pipes
Any heat pipe system works in conjunction with a fan and heatsink. Heat pipes are liquid-filled copper pipes that connect to the top of the CPU and carry the heat away from it to a heatsink and fan. This is a highly effective cooling system, combining the most effective characteristics of three different technologies.

Heat pipes are very common in laptop computers, where there is not room to install a CPU fan. The heat pipe carries the heat away from the CPU, to the computer’s fan, which then helps dissipate the heat.

In desktop or tower systems, heat pipes are some of the largest cooling solutions available. However, they are more effective at drawing the heat from the CPU and dissipating it. The major concern when installing a heat pipe system, besides cost, is whether there is enough room within the computer’s case to mount the heat pipe.

there is a large difference between those two go read first, before you post.

they do not use water, they use a ethectic liquid that resembles water. distilled or not

Type I ultra pure water (Milli-Q water, or others) are fairly common among all labs. They are not corrosive to stainless steel.

purified water is never distributed through stainless steel partly because concern of contamination. Metal reacts not only with oxygen, but also many pollutants in the air. Overtime on metal surface will build up a layer that has all kind of compounds in them. When water flows through, ions get picked up.

However, the most major reason would be that glass is better in all respect. The reason glasswares are commonly used in the lab have little to do with pure water. Glasswares are relatively stable across wide range of pH and very hard to be oxidized or reduced. Plus, glasswares are cheap, extremely easy to manufacture, and transparent, so you can see through. You will really only need metal if extreme pressure or temperature is required.

As a matter of fact, it is also unwise to use glassware to distribute ultrapure water--you will get ion contaminations from glass as well. Purified water are actually almost always stored in plastic containers and distributed through plastic tubes.

water at high pressure, and different temperatures can still corode. even if it's distilled. that's just how the laws of nature work.

i don't get it either why you bring pipes in to this, cause AW clearly is using a heatsink. not a vapor chamber not a heatpipe, they use heatsinks with 5 heatsinkpipes. with 2 fans attached to the heatsink. the pipe is just to MOVE the heat from the DIE AREA to the HEATSINK where the fans cool off the HEATSINK. and that phase change of one side being cooler than the other, makes the eutectic liquid within the heatsinkpipe flow.



the picture above is a laptop with a heatpipe system



and this is a heatsink of a laptop. do you see the grills where the heatpipes do not poses ? in those grils are also (in some heatsink) the eutectic liquid. so it cools at two places. within the pipe to transfer the heat to the fins, and the fins themselfs. but those are the more expensive heatsinks. an intercooler is also a heatsink, where Nitrous Oxide (Liquid or gas) flows throug. you can use nitrous within your intake manifold, or to cool turbo's etc. i've worked with a share different amount of heatsinks. plss do not let me pull out scienfitic research for professional racing teams about the workings of a heatsinks. heatsink cooling within a laptop on a small scale is nothing compared to a car that can make over a 1000 ponies with turbo's that can become almost 1000C hot.



edit: it's a honda civic you won't find on the internet cause i build it, and it's a work in progress.

 

Dell stated they have a vapor chamber in use to spread the heat from the cpu die to the full heatplate and transfer the heat more quickly from the cpu die to all heatpipes. The heatpipes in the end will do the rest and push the heat to copper rads.

Until we havent seen the underside of the heatsink it is impossible to say if they actually kept their word or not. A vapor chamber on the bottom doesnt rule out a heatpipe on the top.

 

Yeah, the re-design is a Vapor chamber heat-spreader for Cpu instead of the copper cold plate. But still the same TRIPOD only in other clothes. People forget that Dell continued use the old fashion heatsink/heat pipe cooling for the Gpu. They couldn’t do it otherwise because of the Unified heatsink design. Half baked!!

 

...last review

 

In light of all this discussion about the heatsink and cooling problems, I wish Dell offered the 17R5 in a 8850H/GTX1080. While they are at it, they could add the FHD 120hz Chimei TN panel as an option as well.

 

that could be a really nice setup. And one without overheating problems.

 

I dont mind a shared heatsink, You cant cool a GTX1070/1080GTX with a single fan, so you need 2 fans, but if you want a laptop to be portable and have a large battery you need to share those heatsinks between components (90% laptops do this). If a person doesnt want it, they should buy another laptop that but also accept another compromise which is size/weight or batterylife.

Laptops are always a compromise, its the job of the customer to choose which compromise they accept.

 

Yeah, it actually really surprises me that they don't already offer those options. Every other competitor (MSI, Auros, Asus, HP) offers the GTX 1080 with the cheaper i7 and also has FHD 120hz+ options.

I guess the G703GI probably has close build quality but I do enjoy having Optimus support to get 8 hour battery life with the Alienware. I also still like the Alienware keyboard more than the Asus.

 

you don't mind it, but other people that like to tinker to get every MHZ out of their hardware, do not like a shared heatsink because it only has drawbacks.

as for cooling a gtx 1080 with a single fan, my OC'ed 1080 that pushes desktop figures won't get hotter than 70C degrees (with a 150 mhz on core and 400 on memory). so the 1070/1080 cooling with a single fan is easily possible.

even the 1080 t.i. has a single blower style fan so i'm very curious about your sources that says that a 1080 cannot be cooled with a single fan.

airflow is as much as important as the type of cooling used. a single fan that moves 17 cfm of air, is more quiter, and lasts longer then two fans that each blow 10 cfm. not only will that create a high pitch anoying noise (like how the fan of the 7820Hk can ramp up when you OC ), but it won't move as much air due two fans having to combine their power.

What happens is that the maximum airflow of a fan is X. When you add a resistance (heatsink) in front of the fan, the resistance lowers the amount of flowing air by Y (X/Y). Adding another fan (+X) makes the heat-sink-resistance divide by 2X fans (2X/Y). However, the effect of adding more fans quickly diminishes AND as soon as the maximum airflow of used fans is reached, no further airflow can be achieved. For example: Imagine you are driving 1 car at 100km/h while pushing the gas pedal all the way down. Then you attach a 1000kg cart behind the car (resistance). This makes it go at 80km/h instead. You then attach another identical car in front of your car, with the same amount of gas. This divides the weight of the cart over two cars. (1000kg/2 cars). This makes the resistance for each car much smaller and they reach a speed of 90km/h (10km more than when only 1 car was pulling.) Does this mean that attaching 100 cars make them go 10km/h*100 cars = 1000km/h? NO, since their original max speed is 100km/h, it does not matter how many cars we attach - they can never reach more speed than 100km/h. The resistance of the 1000kg cart becomes smaller the more cars we attach, but already after 1 extra car, we only gain a small decrease in resistance of each car.

 

The desktop gpu has a 6 times larger heatsink at least and a fan with is 4 times higher and a much larger flow of air due to that size. If you dont want your laptop to be as thick and big than you cant cool it with 1 fan

 

about that you'er right, but the AW cools the gpu without problem (only finfet/vrms can be a problem) even if you check notebookcheck the 1080 has a max of 86C and moslty a average around 70C so i do not see any problems over there. the founders editin on the pc also exhibits those temperatures. it's the cpu that's been a problem since they went BGA. even the 17 Ranger(5) can cool a 1070 with a slight mod to the heatsink. and that's a mxm card. It's BGA that has been the most troublemaker since intel wanted to screw us over even more. coffee lake is the third refresh based on broadwell, and people are still buying their products blind, and when a company that's all about gaming does not want to spend R&D to make a cooling system custom to their needs and chassis they will go nowhere. i'm very curious about the next AW line-up but by then i think i would've switch back to LGA already. @Papusan keeps teasing me with nice score's so i'm heavily leaning towards going back to where the bulk and power is. you won't never see an SLI in a AW laptop again... salute mx18 may you rest well.

 

They could still use Unified heatsink, but why make it half baked when they know very well about all overheating problems those models is known for?

This is their promo... “Alienware 15 and 17 gaming laptops will offer new 8th Gen Intel® Core™ i5, i7, and i9 processors with up to 6-cores, enabling overclocking up to 5.0GHZ for the first time ever on Alienware’s most powerful family of laptops. To extract maximum performance from Intel’s top powerhouse processors, Alienware mechanically engineered improved cooling technology, Alienware Cryo-Tech v2.0, with 50% thinner fan blades and a vapor chamber on the CPU to cool down the higher number of cores more efficiently. Fusing these breakthrough innovations into new Alienware 15 and 17 laptops adds a measurable 10% performance boost”

Maybe this isn’t mentioned but Dell prefered to decrese fan noise vs. previous models (which had massive overheating problems). Not exactly the correct way to increase the cooling capacity. Aka they could fully re-design the Unified heatsink (normal Vapor chamber) and put in more noisy aka stronger fans. All I see from what’s done is backwards engineering.

We talk about a 17,3 inches model near 4.5Kg + big 1 kg 330W psu. Make it 4-10mm thinner vs earlier models, but increase the footprint (to be able to use max capacity battery) + the increased weight seems too weird for me.

 

I really hope mine from hidevolution with grizzly thermal wont have this issue or ill refund on the spot. Alienware has no right to keep selling over heating laptops I don't get it.