GS65 Re-pasting

I need to re-paste this laptop and I'm just wondering what the best method to go about doing this is. What paste to use, etc. So any help will be appreciated. Also got the go ahead from tech support, just in case. You never can be to careful lol.

 

I've read on a thread here that sometimes, well a lot of the time, the heat sink is warped. One thread concluded that re-pasting did absolutely nothing. I'm considering just to buy a completely new heat sink along with high quality thermal paste just to be absolutely sure. https://www.amazon.com/HK-part-Comp...coding=UTF8&psc=1&refRID=M4Z06BY7YGRQBW37HQ34
Just curious about anyone else's ideas.

Here's the thread.
http://forum.notebookreview.com/threads/gs65-repaste-question.820678/

 

With warped/uneven heatsinks the best approach is to use thicker thermal paste like IC diamond. The "best" way though, would be to properly sand the heatsink to make it even, then apply liquid metal thermal paste.

Aside from repasting, you need to undervolt the laptop as well. A combination of well made repaste job as well as undervolting has huge results.

 

Is there a place i can bring this to and have them do it for me out of pocket? I would love to have liquid metal, but i cant do that myself.

 

I believe @woodzstack provides this kind of services (among other things).

 

Sorry, I either tend to do that stuff myself. Other than doing it yourself, you can purchase it as a service when buying from retailers but maybe as Arondel commented, you can probably contact someone that can perform it for you.

 

Just by eye-balling I would leave it alone and if you're unhappy with it send it back. There is no way that heatsink is going to supply enough pressure to get an even core temp no matter what you do. Yes LM will mask this for awhile but LM does dry as the liquid part of the amalgam (Gallium) bonds to the copper and what will be left are the solid bits, mainly indium and tin and it will need to be re-applied. Might take a year, might take two or more but eventually it will "dry" and need to be redone.

The benefit of using those wax pads is in part to fill gaps as stated before but also to provide shock protection against the chips themselves should the laptop fall. Ultimately the best way to go is using a PGS (Pyrolytic Graphite Sheet) pad of some kind but that normally requires a great deal of pressure to get good results from it and 3 point heatsinks like that wont achieve it well.

 

yeah I still get plenty of requests to do such jobs, and I do my best on each one like its my own.

 

Thanks you to everyone!