Help please: Extremely fast Thermalpaste Pumpout

Hi everyone
I have Lenovo Y540 9750h with 2060

in the first 3 weeks temps were very good like 85-90 degree with encoding at 75 watts but after that core 0 2 4 jumped to 96-99 degree the moment system gone under load

so I repasted with thermalright Chill factor 3 and in the first day it was 75 degree with 70 watts load but in the second day it would reach 96 degree again.

i thought maybe thermalpaste was bad so i bought arctic mx4 but this one will not last to second day it will pump out fast.

I fixed the higher temps of cores 0 2 4 with changing some of thermal pads with 0.5mm ones (im sure they make contacts) but pump out still happens.

I tried everything(with changing things around 25 times) and im tired of this ****​

things Iv tried:

• putting extremely viscous thermal paste around the die
• or thermal pad around it
• loosening screws
• putting thermal pad between board and heatsink where pressure is higher
• putting constant pressure on heatsink with filling the gap with body using 1.5mm thermal pads

now i have to put my TDP around 50 watts for cpu to stay at 80

and yes iv searched the network for weeks now and i will not/cant use LM
after 3days:


first day temps:

one week later:


Please HELP!!

 

Try ICD or Phobya NanoGrease Extreme. ICD is the best choice if you have this type problem.

 

Thanks I read these brands in other topics but unfortunately they're not available in my country and if I want to buy from Amazon it requires one months to 6weeks to reach me plus I have to pay around 20$ for transportation
Here I can get cooler master, arctic, gelid extreme, deep cool!
But the problem is not viscosity the factory thermal paste was pretty viscous but still was moved towards the back.

I should use something to stop thermal paste from moving. But I cant find the right way

Can Anyone confirm if all y5** have the same problem or not?

 

Here is another thread with same problem http://forum.notebookreview.com/thr...avoiding-pumpouts.833774/page-2#post-11039753

Read it.

Either try a new heatsink or fix what you already have. There is no other or easy ways to stop thermal paste from moving. You need very good fits between HS and die + thermal paste that work well to reduce pump out effect. Nothing in between. And of course perfect fitted thermal pads.

You could also try swap out thermal pads with K5 PRO viscous thermal paste to improve the heatsink pressure over die. Here's the link of the product https://www.computer-systems.gr/en/content/product/k5-pro-60g-3x20g


Good luck.

 

My "cheap and reliable" solution is to use Arctic Silver 5. It may or may not work for you. Also Alphacool ( https://www.ebay.ca/itm/Alphacool-1...336837?hash=item1a0766f205:g:SdwAAOSwjCBd9~de) and EC 360 16.6W/mK ( https://www.ebay.ca/itm/EC360-PLATI...938054?hash=item1a9485ac46:g:jgwAAOSwwJ1eR~4r) are serving me very well as thermal pads on my toughbook ( http://forum.notebookreview.com/thr...n-cf-19-mk-6-57-degrees-celsius.833483/page-4)

I cannot say for Y series, but I can confirm pumpout using Arctic MX4 and Noctua NT-H1 on T410,420,430,480 and W530.

I will be trying Papusan's suggestion the next time I shop. Right now Arctic Silver 5 is still my "cheap, old, reliable" solution but not the best performing.

 

Regarding pads... The 17w/mk is too stiff. I would rather go for Gelid 12W/mk pads. Much softer. Stiff pads is not a solution if you have trouble with heatsink fits on die. If you want go for Alphacool, then go for the softer 14W/mk variant. They should be cheaper as well.


http://forum.notebookreview.com/thr...feedback-thread.806161/page-236#post-11005574

http://forum.notebookreview.com/thr...g-owners-lounge.809622/page-174#post-10971145

http://forum.notebookreview.com/thr...feedback-thread.806161/page-236#post-11005591

 

Thanks everyone
I'm going to open it again tomorrow
and I was thinking of removing thermal pads on chokes altogether and using viscous thermal paste to lower the upper side of heatsink
I know for a fact that lower left side has higher pressure (I saw it right after applying paste)
and that thermal paste will flatten between heatsink and chockes

The only thing I worry is if laptop has a proper thermal throttling mechanism for vrm to stop the possible overheating
I know asus uses thermal paste for every where

 

Thanks for thermal pad link I have both soft and hard pads and I tried them but the difference between lower and upper side is just too much

And an important question I forgot to ask
Is there a possibility that the pressure on die is too much or becomes too much(possibility to hurt the die)?!

 

Be you sure... They add in thermal throttling mechanism for vrm and a lot more. This is Dell, but all is the same
How Dell cripple performance explained by....

Not with Notebooks. Of course it could if you used too thick copper shims between die and HS.

 

Maybe Thermal Grizzly Carbonaut would be your best option? It`s not the best tempwise, but lasts forever and is impossible to "pump out"

 

Try with prolimatech pk3, If you were still looking for a solution to your problem.