MiSJAH's guide on how NOT to Liquid Metal repaste!!

The X5V 6 has no thermal pads, the X5V 7 may have thermal pads instead of thermal paste.

 

Thank you. Any other general tips you can give me regarding LM repasting? I really have this sense that one can’t mess it up if the die is secured by tape on its edges properly.

 

Less is more.

 

Okay, just a really tiny dot for the CPU and GPU. Got it.

 

Spread it over the die with something non-absorbent like a toothpick or similar.

 

If you should decide to use Conductonaut you will find special "Q-Tips" inside that will help spreading.

Best regards

phila

 

Wouldn’t the black cotton swab be enough? I don’t know if they sell the CLLU brush that I unlock used separately.

EDIT:

That’s what I was thinking as well. Is the brush better? If yes, where do buy one?

 

Both the Q-tip with Grizzly and the brush (comes in the CLLU pack) are not the most effective.

 

Oh. Why is it that way? If you use a toothpick, wouldn’t that be difficult to spread things evenly?

 

With a toothpick you can almost drag liquid to where you need, more accurate than qtip or a brush.















(or maybe I'm a bit thug handed).

 

Did you fry it again? How did it go?

 

Im going to repaste my x7 v7 with LM. I will be careful! Im glad i read this thread. Thanks

 

If i recall correctly, the x5 v7 had pads (can't recall if .5 or 1mm) under the heatpipes, and paste under the memory dies (and obviously the CPU and GPU).

 

I think this belongs here:
Looks like this forum strips out custom start times to videos when it embeds them, I was trying to skip straight to 5:07

 

Hahahaha, I hope that was a typo

But yes, I did try again. Everything went swimmingly.

 

Yeah, You finally learned how to...

 

How did you get the camera in my bathroom?






































































































And thanks, roundup is good. <3

 

Anyone find that after applying a few times that the lm doesn't stick or spread?

 

No. Just no. I stopped right there.

With LM,

(a). Less is more.

(b). Do not compensate for poor heat-sink contact with more LM. That's a recipe for disaster waiting to happen.

If you cannot achieve proper heat-sink contact in the first place with the component's die (GPU or CPU), LM isn't for you.

 

It was a steep learning curve.

But how do you learn without making mistakes?

2nd, 3rd, and 4th time with LM have been fine

 

It's absolutely worth it.

No regrets.

 

Exactly

 

Exactly.

I have a new machine that will be LM'd when I get back from climbing.

(Two weeks in an RV with a laptop in the rocks, tethered to my cell for internets = bliss).

 

LM does neither.

And that's why it has to be spread out manually at the application phase.

Also, ensure that its' seal is as air-tight as much as possible. Eliminating (or slowing down) oxidation significantly (which is inevitable when you have poor heatsink contact) should prevent LM from "drying out".

 

So I just realised after this thread got bumped I hadn't given credit and praise due to @woodzstack.

This guy patiently spoke with me on the phone for like an hour, offering great advice and assistance.

@woodzstack please accept my apologies for not making this post sooner, and thanks for all of your help.