Thermal Compound Application Method?

So I grabbed some Gelid Extreme paste.
I wanted to see what method they suggested to apply their product and I could not find any place where they had a suggestion.

So I took to the internet and I found that really application methods vary greatly.
It seems split between the rice/pea method, the X method, and spread thin and even method.
From what I have read so far it seems people like to spread as they seen it spread but have heard people say that can cause bubbles and it doesn't actually spread as evenly as say the grain of rice method.
Again those were just common comments I read.

So it got me curious. What method do you use? Why?
I haven't really repasted in a long while honestly.
Before with AS5 I used to use the grain of rice method and just let the pressure of the HS spread the paste over the heat spreader.

Here is a poll to go with the post.

 

I would suggest line method with CPU, x-pattern with GPU. Apply a little more than you need to ensure 100% coverage.

 

How big of a line?

 

Can't say, use your feeling.

 

Check out the youtube videos. There are a bunch where a guy uses different different paste methods and then places a clear plastic layer on top and you can see how it spreads.

 

it comes with a plastic palette, so spread method is the best for you, just ensure to make a thin layer, like painting in all the transfer surface. like number 2

 

Ya I saw that too...
I also assumed that spreading was the intended method but then I read that several did the lines or blob.. I guess I could try different methods to test.
Im doing it first on a desktop so its easier to test.

 

Ok so I did a line the first time and it spread evenly when I took it off. Temps maxed out at 65c when doing an Intel Extreme Tuning stress test for 10 mins.
Did a then layer spread and the max temp was 69C when doing another 10 min stress test.
Will do the line one more time to see if it goes back to the first results.

 

Thin 3/4 long line on bare die(mobile cpu) X cross for desktop processor and gpu.

 

I always spread my paste on a laptop. Just make sure to put enough on there. After spreading the paste evenly and if there is any extra left over (ie..if it seems too much) I work the paste toward the middle to create a small "hill," in the center of the GPU so that when the heat sink presses against it, the paste will spread from the center out. As for the CPU (skylake), I work the extra paste toward the center to create a LINE hill/mountain, length wise, about 3/4 from the end of the CPU. Again, so when the heat sink presses on top of it, it will spread from the center out; as if you were doing just a regular line method.

Note: If you are using traditional paste, make sure you spread it out evenly. Ex. Watch this video at 1:35 and look at the upper left. See where the layer of paste is thinner than the rest of the paste? That is not good. It's important to spread the paste so that it has an even layer all throughout the die. You will also see why I DO NOT favor the dot method or any other goofy method that doesn't provide complete coverage.

The fail proof way is to use a line on the CPU (about the size of a grain of rice, 3/4 of the way across length wise) and for the GPU I would use the X method except I also add a small/thin plus (+)....The ends of the X should cover about 90% of the GPU and the length of the + should go from the center of the X to about a half way to the end of the GPU.

 

For gelid the paste method is up to preference. If down the road you want to try something like liquid ultra, you MUST do the spread method as it will not spread like your traditional type of paste. Doesn't apply now but just something to keep in mind.

 

I seem to get better results spreading Gelid with the included applicator than the dot method I'm used to.

 

Hmmm...
Not me I tried a total of 4 times on a desktop proc.
Each time I did the line / dot method it was slightly lower temps.